Diamond Wafering Cutting Blade

Recommended for brittle materials such as ceramics, glass, carbides and other heat resistant materials. Wafering Blades are available from inventory in many different diamond concentrations, mesh sizes, bond hardness, & inside diameters. Available from stock for any manufacturers low or high speed sectioning/wafering saw.

Hans precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life.As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.Diamond Wafering Blades are available in high or low concentration,A range of wafering blades specifically developed to provide precise and accurate sectioning of metallographic samples. Sizes from 127mm to 203mm diameterOur full range of blades covers all types of materials including basic metals, ceramics, glass, soft/gummy materials, alloys, composites and much more.

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