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Electroplated Diamond Products ( 155 )
Flexible Diamond Products ( 91 )
Resin Bond Diamond Product ( 169 )
Diamond Band Saw Blades ( 21 )
Backpack Drill Rig ( 4 )
Abrasive Lapping Film ( 29 )
Polishing Lapping Pad ( 11 )
(Total 2 Products for Electroformed Hubless Type Dicing Blades)
Nickel Bond Electroform Diamond Wafer Dicing Blades
Diamond Wafer Dicing Blades Nickel Bond dicing blades are available with and without hubs. Capable of maintaining excellent form & sharpness. Widely used for cutting wafers and thin substrates. Nickel Bond dicing blades provide minimum level of chipping on wide variety materials.Diamond Grit 3 to 70 micron,Minimum...
Diamond ID Dicing Blades ID saw blades were initially used primarily for slicing germanium and silicon semiconductor materials. A majority of ID saw blades are still used to process these materials. Now a broader set of materials such as GGG, samarium-cobalt, sapphire, magnetic irons, gallium arsenide/phosphide, and...
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.